Polymer bonding temperature impact on bonded stack morphology and adherence energy-Reference-Cited by-同舟云学术

Polymer bonding temperature impact on bonded stack morphology and adherence energy

Published:2017-08-10 Issue:1 Volume:24 Page:793-799
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Montméat P.,Enot T.,Louro De Oliveira G.,Fournel F.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s00542-017-3519-1/fulltext.html

Reference26 articles.

1. Argoud M (2012) Phd Dissertation, Grenoble

2. Den Besten C et al (1992) Polymer bonding of micro-machined silicon structures. Micro Electro Mech Syst 92:104–109

3. Boiko YM et al (1997) Bonding at symmetric polymer/polymer interfaces below the glass transition temperature. Macromolecules 30:3708–3710

4. Cha D-Y et al (2010) Study on low temperature bonding technology for optical PCB with polymer intermediate layers. J Korean Inst Electr Electron Mater Eng 23(1):29

5. Charbonnier J et al (2009) Integration of a temporary carrier in a TSV process flow. Electron Compon Technol Conf 2009 ECTC 59:865–871

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