Integration of a temporary carrier in a TSV process flow-Reference-Cited by-同舟云学术

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Integration of a temporary carrier in a TSV process flow

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
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Author:

Charbonnier J.,Cheramy S.,Henry D.,Astier A.,Brun J.,Sillon N.,Jouve A.,Fowler S.,Privett M.,Puligadda R.,Burggraf J.,Pargfrieder S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074114.pdf?arnumber=5074114

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31

2. Pre-fabricated High-density TSV Interposer for Programmable IC Applications;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

3. High power 2.5D integrated thermoelectric generators combined with microchannels technology;Energy;2022-08

4. Fundamentals and Failures in Die Preparation for 3D Packaging;3D Microelectronic Packaging;2020-11-24

5. Through Glass VIAS using an Industry Compatible Glass Handling Solution;2020 International Wafer Level Packaging Conference (IWLPC);2020-10-13

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