Pre-fabricated High-density TSV Interposer for Programmable IC Applications-Reference-Cited by-同舟云学术

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Pre-fabricated High-density TSV Interposer for Programmable IC Applications

Published:2022-10-26 Issue: Volume: Page:
ISSN:
Container-title:2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Ouyang T. Y.¹,Hung Y. T.¹,Lee O. H.¹,Li S. Y.¹,Chiu W. L.¹,Hung T. Y.¹,Wu S. H.¹,Chang H. H.¹

Affiliation:

1. Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute Rm. 255, Bldg. 15, No.195, Sec. 4, Chung Hsing Rd., Chutung,Hsinchu,Taiwan (R.O.C.),31040

Funder

Ministry of Economic Affairs

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966630.pdf?arnumber=9966630

Reference8 articles.

1. Characterization and management of wafer stress for various pattern densities in 3D integration technology

2. Thermo-Mechanical Design Rules for the Fabrication of TSV Interposers

3. Through silicon vias technology for CMOS image sensors packaging

4. Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results

5. Integration of a temporary carrier in a TSV process flow;charbonnier;IEEE Trans Compon Packag Manuf Technol,2013

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