Author:
Dragoi Viorel,Pabo Eric,Burggraf Jürgen,Mittendorfer Gerald
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference16 articles.
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3. Dragoi V, Pabo E (2010) Wafer bonding process selection. ECS Trans 33(4):509–517. doi: 10.1149/1.3483542
4. Dragoi V, Farrens S, Lindner P (2005) Low temperature MEMS manufacturing processes: plasma activated wafer bonding. MRS Proc 872: J7.1.1–J7.1.6
5. Dragoi V, Cakmak E, Pabo E (2010a) Metal wafer bonding for MEMS devices. Romanian J Inf Sci Technol 13(1):65–72
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