Author:
Crnogorac Filip,Birringer Ryan,Dauskardt Reinhold,Pease Fabian
Cited by
7 articles.
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1. Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Exploring Ru Compatibility With Al-Ge Eutectic Wafer Bonding;Journal of Microelectromechanical Systems;2022-08
3. Metallic alloy seal bonding;Handbook of Silicon Based MEMS Materials and Technologies;2020
4. Eutectic Bonding;CIRP Encyclopedia of Production Engineering;2019
5. Eutectic Bonding;CIRP Encyclopedia of Production Engineering;2018