Resistive Memory Devices at the Thinnest Limit: Progress and Challenges

Author:

Li Xiao‐Dong1,Chen Nian‐Ke1,Wang Bai‐Qian1,Niu Meng1,Xu Ming2,Miao Xiangshui2,Li Xian‐Bin1ORCID

Affiliation:

1. State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun 130012 China

2. School of Integrated Circuits Huazhong University of Science and Technology Wuhan 430074 China

Abstract

AbstractThe Si‐based integrated circuits industry has been developing for more than half a century, by focusing on the scaling‐down of transistor. However, the miniaturization of transistors will soon reach its physical limits, thereby requiring novel material and device technologies. Resistive memory is a promising candidate for in‐memory computing and energy‐efficient synaptic devices that can satisfy the computational demands of the future applications. However, poor cycle‐to‐cycle and device‐to‐device uniformities hinder its mass production. 2D materials, as a new type of semiconductor, is successfully employed in various micro/nanoelectronic devices and have the potential to drive future innovation in resistive memory technology. This review evaluates the potential of using the thinnest advanced materials, that is, monolayer 2D materials, for memristor or memtransistor applications, including resistive switching behavior and atomic mechanism, high‐frequency device performances, and in‐memory computing/neuromorphic computing applications. The scaling‐down advantages of promising monolayer 2D materials including graphene, transition metal dichalcogenides, and hexagonal boron nitride are presented. Finally, the technical challenges of these atomic devices for practical applications are elaborately discussed. The study of monolayer‐2D‐material‐based resistive memory is expected to play a positive role in the exploration of beyond‐Si electronic technologies.

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Natural Science Foundation of Jilin Province

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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