Sensitivity analysis on the fatigue life of solid state drive solder joints by the finite element method and Monte Carlo simulation

Author:

Cho Yeungjung,Jang Jinwoo,Jang GunheeORCID

Funder

Samsung

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Association EI, others (1989) JEDEC STANDARD: Temperature Cycling JESD22-A104-D

2. Chang J, Wang L, Dirk J et al (2006) Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device. Weld J 85:63–70

3. Chen L, Zhang Q, Wang G et al (2001) The effects of underfill and its material models on thermomechanical behaviors of a flip chip package. IEEE Trans Adv Packag 24:17–24

4. Evans JW, Evans JY, Ghaffarian R et al (2000) Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method. Microelectron Reliab 40:1147–1155

5. Kim M-K, Joo J-W (2012) Thermo-mechanical Behavior of WB-PBGA Packages Considering Viscoelastic Material Properties. J Microelectron Packag Soc 19:17–28

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