Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method-Reference-Cited by-同舟云学术

Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method

Published:2000-07 Issue:7 Volume:40 Page:1147-1155
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Evans John W,Evans Jillian Y,Ghaffarian Reza,Mawer Andrew,Lee Kyoung-Taeg,Shin Chang-Ho

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

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3. Solder creep-fatigue analysis by an energy-partitioning approach;Dasgupta;Trans ASME,1992

4. Engelmaier W. Fatigue life of leadless chip carrier solder joints during power cycling. IEEE Trans Compon, Hybrids Manufact Technol 1983;6(3)

5. Engelmaier W, Attarwala AI. Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards. IEEE Trans Compon, Hybrids Manufact Technol 1989;12(2):284–96

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