Experimental and numerical simulation of mechanical behavior of micro-scale SAC305 solder joint based on joint height-Reference-Cited by-同舟云学术

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Experimental and numerical simulation of mechanical behavior of micro-scale SAC305 solder joint based on joint height

Published:2020-08-29 Issue:12 Volume:64 Page:2101-2108
ISSN:0043-2288
Container-title:Welding in the World
language:en
Short-container-title:Weld World

Author:

Yin Limeng,Zuo Cunguo,Zhang Zhongwen,Wang Gang,Yao Zongxiang,Su Zilong,Fang Naiwen

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

https://link.springer.com/content/pdf/10.1007/s40194-020-00985-1.pdf

Reference19 articles.

1. Tu KN (2003) Recent advances on electromigration in very-large-scale-integration of interconnects. J Appl Phys 94(9):5451–5473. https://doi.org/10.1063/1.1611263

2. Fortier A, Pecht M (2017) A perspective of the IPC report on lead-free electronics in military/aerospace applications. Microelectron Reliab 69:66–70. https://doi.org/10.1016/j.microrel.2017.01.001

3. Zhang L, Han J, He C, Guo Y (2013) Reliability behavior of lead-free solder joints in electronic components. J Mater Sci Mater Electron 24(1):172–190. https://doi.org/10.1007/s10854-012-0720-y

4. Kong X, Sun F, Yang M (2018) Analysis of creep performance of micro solder joints under different loading mode. Chin. J Mater Res. 32(3):184–190. https://doi.org/10.11901/1005.3093.2018.124

5. Pecht M, Shibutani T, Wu L (2016) A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. Microelectron Reliab 62(62):113–123. https://doi.org/10.1016/j.microrel.2016.03.020

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures;International Journal of Impact Engineering;2023-05

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