Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference38 articles.
1. Alam M, Lu H, Bailey C, Chan YC (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Comput Mater Sci 45(2):576–583
2. An T, Qin F, Li J (2011) Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectron Reliab 51(5):1011–1019
3. Bang W, Moon M-W, Kim C-U, Kang S, Jung J, Oh K (2008) Study of fracture mechanics in testing interfacial fracture of solder joints. J Electron Mater 37(4):417–428
4. Basaran C, Tang H, Nie S (2004) Experimental damage mechanics of microelectronic solder joints under fatigue loading. Mech Mater 36(11):1111–1121
5. Bhate D, Chan D, Subbarayan G, Nguyen L (2008) A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints. J Electron Packag 130(2):130:021003-1–021003-9
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