Experimental damage mechanics of microelectronic solder joints under fatigue loading
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference27 articles.
1. Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibration;Basaran;Applied Mathematical Modeling,1998
2. Selecting a temperature time history for predicting fatigue life of microelectronic solder joints;Basaran;Journal of Thermal Stresses,2001
3. Measuring intrinsic elastic modulus for Pb/Sn solder alloys;Basaran;Mechanics of Materials,2002
4. Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronics packaging;Basaran;International Journal of Damage Mechanics,2002
5. Basaran, C., Wen, Y., Grain growth in eutectic Pb/Sn Ball Grid Array solder joints. ITherm 2002 Conference
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