SELECTING A TEMPERATURE TIME HISTORY FOR PREDICTING FATIGUE LIFE OF MICROELECTRONICS SOLDER JOINTS-Reference-Cited by-同舟云学术

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SELECTING A TEMPERATURE TIME HISTORY FOR PREDICTING FATIGUE LIFE OF MICROELECTRONICS SOLDER JOINTS

Published:2001-11 Issue:11 Volume:24 Page:1063-1083
ISSN:0149-5739
Container-title:Journal of Thermal Stresses
language:en
Short-container-title:Journal of Thermal Stresses

Author:

Basaran Cemal,Dishongh Terry,Zhao Ying

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/01495730152620069

Reference30 articles.

1. Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations

2. Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

3. A Thermodynamic Framework for Damage Mechanics of Solder Joints

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review;Materials;2024-05-15

2. The Thermal–Structural Analysis of a Pin Under High Accelerated Stress Screening Test;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-09

3. Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-10

4. Thermomechanical fatigue damage evolution in SAC solder joints;Materials Science and Engineering: A;2007-02

5. Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading;IEEE Transactions on Components and Packaging Technologies;2006-12

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