Physics of failure for interconnect structures: an essay

Author:

Tilgner Rainer

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Alpern P et al (2002) A simple model for the mode I popcorn effect for IC packages with copper leadframe. IEEE Trans CPT 25(2):301–308

2. Altes A et al (2006) Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity. Microelectron Reliab 46:1525–1529

3. Browning GV et al (1965) Failure mechanisms associated with thermocompression bonds in integrated circuits. Proc Symp Phys Failure Electron 4:428–446

4. Fukuzawa I et al (1985) Moisture resistance degradation of plastic LSI’s by reflow soldering. Proc IEEE/IRPS 23:192–197

5. IPC/JEDEC J-STD-020D, “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices”, 2004

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