Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps
Author:
Affiliation:
1. Delft University of Technology,Delft,Netherlands
2. NXP Semiconductors,Nijmegen,Netherlands
3. NXP Semiconductors,Eindhoven,Netherlands
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564953.pdf?arnumber=10564953
Reference18 articles.
1. Physics of failure for interconnect structures: an essay
2. A review of typical thermal fatigue failure models for solder joints of electronic components
3. Handbook of Electronic Package Design
4. Examples for failures in power electronics systems;Wolfgang,2007
5. Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates
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