Author:
Pecht, Michael,Rafanelli, Anthony J.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Continuous Reliability Improvement;Product Reliability, Maintainability, and Supportability Handbook, Second Edition;2009-04-16