1. Anderson RM and Klepeis SJ “Combined Tripod Polishing and FIB Methods for Preparing Semiconductor Plan View Specimens”. Specimen Preparation for Transmission Electron Microscopy of Materials IV, (eds.) R. Anderson, et. al., Materials Research Symposium Series 480, pp 187–192 (1997).
2. Anderson RM, et al., Microscopy of Semiconducting Materials 1989, Proceedings of the Physics Conference held at Oxford University, 10–13 April 1989, ed. by Cullis, A. G. and Hutchison J. L., Institute of Physics Conference Series Number 100, Bristol and New York (1989).
3. Anderson RM, et al., Proceedings EUREM 1996, Steer M. Cottrell D (eds.) p 79–80 (1992).
4. Anderson, RM, “Precision Ion Milling of Layered, Multi-Element TEM Specimens with High Specimen Preparation Spatial Resolution” In Specimen Preparation for Transmission Electron Microscopy of Materials-III, ed. Anderson, et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 141–148 (1992).
5. Anderson, RM, et al., Microbeam Analysis—1995, Proceedings of the 29th Annual Meeting of the Microbeam Analysis Society, ed. E. Etz, p. 135 (1995).