Author:
Anderson Ron,Benedict John
Abstract
It is now a requirement in the semiconductor industry to prepare TEM specimens of pre-specified regions with a specimen preparation resolution exceeding 100nm. In other words, given the coordinates x, y, z of the location desired for TEM analysis, the TEM specimen preparation procedure must yield a thin TEM specimen containing the point x, y, z plus or minus 100nm. Preparation of failure analysis specimens in other fields of endeavor, such as: metallurgical, ceramic, composite material laboratories etc., have specimen preparation spatial resolution requirements below one micron in some cases with the likelihood that greater precision will be required in the future.
Publisher
Springer Science and Business Media LLC
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