Sensitivity analysis of plating conditions on mechanical properties of thin film for MEMS applications
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s12206-011-0205-6.pdf
Reference21 articles.
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2. K. Kataoka, S. Kawamura, T. Itoh, K. Ishikawa, H. Honma and T. Suga, Electroplating Ni micro-cantilevers for low contact-force IC probing, Sensors and Actuators A, 103 (2003) 116–121.
3. W. M. Huang, Q. Y. Liu, L. M. He and J. H. Yeo, Micro NiTi-Si cantilever with three stable positions, Sensors and Actuators A, 114 (2004) 118–122.
4. W. N. Sharpe, MEMS Handbook, CRC Press, Boca Raton, FL (2002).
5. Y. C. Hu and W. H. Tu, Nonlinear and linearized algorithms for the Young’s modulus extraction of thin films through the capacitance-voltage measurement of microstructures, Journal of Applied Physics, 98 (2005) 104504.
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