An incremental-iterative BEM methodology to solve 3D thermoelastic contact problem including variable thermal resistance in the contact zone
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Physics and Astronomy,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s00161-019-00773-3.pdf
Reference33 articles.
1. Martynyak, R.M., Chumak, K.A.: Thermoelastic contact of half-spaces with equal thermal distortivities in the presence of a heat-permeable intersurface gap. J. Math. Sci. 165(3), 355–370 (2010)
2. Comninou, M., Dundurs, J.: On the Barber boundary conditions for thermoelastic contact. J. Appl. Mech. 46, 849–853 (1979)
3. Comninou, M., Dundurs, J., Barber, J.R.: Planar Hertz contact with heat conduction. J. Appl. Mech. 48, 549–554 (1981)
4. Dundurs, J.: Distortion of a body caused by free thermal expansion. Mech. Res. Commun. 1(3), 121–124 (1974)
5. Alonso, P., Garrido García, J.: BEM applied to 2D thermoelastic con- tact problems including conduction and forced convection in interstitial zones. Eng. Anal. Bound. Elem. 15(3), 249–259 (1995)
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Numerical Analysis of Transient Heat Conduction Problems with Interface Thermal Resistance Based on Extended Spectral Element Differential Method;2024
2. A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems;Engineering Analysis with Boundary Elements;2023-10
3. Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method;Mathematics;2022-06-02
4. Non-linear interface thermal conditions in three-dimensional thermoelastic contact problems;Computers & Structures;2020-12
5. A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging;Engineering Analysis with Boundary Elements;2020-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3