Numerical Analysis of Transient Heat Conduction Problems with Interface Thermal Resistance Based on Extended Spectral Element Differential Method

Author:

Zhao Jianning,Wei Dong,Liu Donghuan

Publisher

Elsevier BV

Reference47 articles.

1. A review on the tooling technologies for composites manufacturing of aerospace structures: materials, structures and processes;Y Li;Composites, Part A,2022

2. Advanced sandwich structures for thermal protection systems in hypersonic vehicles: A review;V T Le;Composites, Part B,2021

3. Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads;R Kothari;J. Sandwich Struct. Mater,2012

4. Transient temperature distribution in a multilayer semiconductor device with dynamic thermal load and non-uniform thermal contact resistance between layers;G Krishnan;Int. J. Heat Mass Transfer,2023

5. Influence of Temperature on the Pressure Distribution Within Press Pack IGBTs;E P Deng;IEEE Trans. Power Electron,2018

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