Author:
Krishnan Girish,Jain Ankur
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference36 articles.
1. A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs);Salvi;IEEE Trans. Components Pack. Manuf. Technol.,2021
2. Cooling a microprocessor chip;Mahajan;Proc. IEEE.,2006
3. Thermal management of microelectronics in the 21st century;Bar-Cohen,1997
4. Thermal challenges in next generation electronic systems- summary of panel presentations and discussions;Garimella,2002
5. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Dev. Lett. EDL,1981
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献