Subject
Applied Mathematics,Computational Mathematics,General Engineering,Analysis
Reference40 articles.
1. The evolution of microprocessor packaging;Mahajan;Int J Technol,2000
2. Emerging directions for packaging technologies;Mahajan;Int Technol J Semicond Technol Manuf,2002
3. Thermal interface materials: a brief review of design characteristics and materials;Mahajan;Electron Cooling,2004
4. BEM Calculation of the complex thermal impedance of microelectronic devices;Vermeersch;Eng Anal Bound Elem,2007
5. Influence of thermal contact resistance on thermal impedance of microelectronic structures;Vermeersch;Microelectron Reliab,2007
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