Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. De Mey G. Thermal conduction in phasor notation. In: Brebbia CA, editor. Proc Boundary Element Technology Conference (BETECH’95); 1995. p. 1–9.
2. Vermeersch B, De Mey G. Sinusoidal regime analysis of heat transfer in microelectronic systems. In: Sundén B, Brebbia CA, editors. Proc 9th Int Conf on Advanced Computational Methods and Experimental Measurements in Heat and Mass Transfer (Heat Transfer IX), Southampton (UK); 2006. p. 449–55.
3. Kawka P. Thermal impedance measurements and dynamic modelling of electronic packages (PhD thesis). Belgium: Ghent University; 2005.
4. Kawka P, De Mey G, Vermeersch B. Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance. Accepted with required revisions for publication in IEEE Trans Comp Pack Technol.
5. Thermal impedance plots of micro-scaled devices;Vermeersch;Microelectron Reliab,2006
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献