1. Degertekin, F.L. andKuri-Yakub, B.T., “Lamb Wave Excitation by Hertzian Contacts With Applications in NDE,”IEEE Transactions on Ultrasonic Ferroelectric Frequency Control,44,769–778 (1997).
2. Lu, Y., Moor, M.V., Queheillalt, D.T., andWadley, H.N.G., “A Lamb Wave Temperature Sensor for Semiconductor Wafer Processing,”Review of Progress in Quantatative Non-destructive Evaluation, D.O. Thompson and D.E. Chimenti, editors, Plenum Press, New York, 509–516 (1994).
3. Suh, C.S., Rabroker, G.A., Burger, C.P., and Chona, R., “Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures,” Symposium on Applications of Experimental Mechanics to Electronic Packaging, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX (1997).
4. Rabroker, G.A., “Laser-induced Stress Wave Thermometry Applied to Silicon Wafer Processing,”Masters Thesis, Texas A&M University, College Station, TX (2000).
5. Wagner, J.W., “Optical Detection of Ultrasound,”Physical Acoustics, Principles and Methods,XIX,201–265 (1990).