On the Fracture Toughness Measurement of Thin Film Coated Silicon Wafers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s12633-014-9215-1.pdf
Reference14 articles.
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2. Zhang S, Sun D, Fu Y, Du H (2005) Toughness measurement of thin films: a critical review. Surface & Coatings Tech 198:74–84
3. Morin P, Raymond G, Benoit D, Maury P, Beneyton R (2012) A comparison of the mechanical stability of silicon nitride films deposited with various techniques. Appl Surf Sci 260:69–72
4. Olson JM (2002) Analysis of LPCVD process conditions for the deposition of low stress silicon nitride. Part I: preliminary LPCVD experiments. Mater Sci Semicond Process 5:51–60
5. Evans AG, Charles EA (1976) Toughness determinations by indentation. J Am Ceram Soc 59:371–372
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