Author:
Park Sun-Joon,Lee Hyun-Seop,Jeong Haedo
Publisher
Springer Science and Business Media LLC
Subject
Management of Technology and Innovation,Industrial and Manufacturing Engineering,Mechanical Engineering,General Materials Science,Renewable Energy, Sustainability and the Environment
Reference9 articles.
1. Berman M., Bibby T., and Smith A., “Review of in Situ & In-Line Detection for CMP Applications,” Semiconductor Fabtech, 8th Ed., pp. 267–274, 1998.
2. Lee Y., Chang, A. K., and Dornfeld, D. A., “Acoustic Emission Monitoring for the Diamond Machining of Oxygen-Free High- Conductivity Copper,” Journal of Materials Processing Technology, Vol. 127, No. 2, pp. 199–205, 2002.
3. Wang, L. and Gao, R. X., “Condition Monitoring and Control for Intelligent Manufacturing,” Springer, 2006.
4. Jeong H., Kim H., Lee S., and Dornfeld D., “Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues,” CIRP Annals-Manufacturing Technology, Vol. 55, No. 1, pp. 325–328, 2006.
5. Karpuschewski B., Wehmeier M., and Inasaki I., “Grinding Monitoring System based on Power and Acoustic Emission Sensors,” CIRP Annals-Manufacturing Technology, Vol. 49, No. 1, pp. 235–240, 2000.
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献