Micro-scale contact behavior and its effect on the material removal process during chemical mechanical polishing-Reference-Cited by-同舟云学术

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Micro-scale contact behavior and its effect on the material removal process during chemical mechanical polishing

Published:2021-04 Issue: Volume:156 Page:106831
ISSN:0301-679X
Container-title:Tribology International
language:en
Short-container-title:Tribology International

Author:

Wang Lin,Zhou Ping,Yan Ying,Hou Changyu^ORCID,Guo Dongming

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Science Fund for Creative Research Groups

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference49 articles.

1. Review on modeling and application of chemical mechanical polishing[J];Zhao;Nanotechnol Rev,2020

2. Advances in chemical mechanical planarization (CMP)[M];Babu,2016

3. Condition monitoring and control for intelligent manufacturing[M];Wang,2006

4. Invention principles and contradiction matrix for semiconductor manufacturing industry: chemical mechanical polishing[J];Sheu;J Intell Manuf,2010

5. Friction force monitoring system in CMP[C]proceedings of JSPE semestrial meeting 2005 JSPE autumn meeting;Haedo,2005

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