Development of green CMP by slurry reduction through controlling platen coolant temperature-Reference-Cited by-同舟云学术

Development of green CMP by slurry reduction through controlling platen coolant temperature

Published:2015-10 Issue:4 Volume:2 Page:339-344
ISSN:2288-6206
Container-title:International Journal of Precision Engineering and Manufacturing-Green Technology
language:en
Short-container-title:Int. J. of Precis. Eng. and Manuf.-Green Tech.

Author:

Yuh Minjong,Jang Soocheon,Kim Hyoungjae,Lee Hyunseop,Jeong Haedo

Publisher

Springer Science and Business Media LLC

Subject

Management of Technology and Innovation,Industrial and Manufacturing Engineering,Mechanical Engineering,General Materials Science,Renewable Energy, Sustainability and the Environment

Link

http://link.springer.com/content/pdf/10.1007/s40684-015-0041-8.pdf

Reference13 articles.

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2. Lee, H., Wang, H., Park, J., and Jeong, H., “Experimental Investigation of Process Parameters for Roll-Type Linear Chemical Mechanical Polishing (Roll-CMP) System,” Precision Engineering, Vol. 38, No. 4, pp. 928–934, 2014.

3. Lee, H., Joo, S., Kim, H., and Jeong, H., “Chemical Mechanical Planarization Method For Thick Copper Films of Micro-Electro- Mechanical Systems and Integrated Circuits,” Japanese Journal of Applied Physics, Vol. 47, No. 7R, Paper No. 5708. 2008.

4. Lee, H. and Jeong, H., “Chemical and Mechanical Balance in Polishing of Electronic Materials for Defect-Free Surfaces,” CIRP Annals-Manufacturing Technology, Vol. 58, No. 1, pp. 485–490, 2009.

5. Jeong, M., Jo, S., Lee, H., Lee, A., Kang, C., et al., “Chemical Mechanical Planarization of Copper Bumps on Printed Circuit Board,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 1, pp. 149–152, 2011.

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