Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference10 articles.
1. Integrated Planarization Technique with Consistency in Abrasive Machining for Advanced Semiconductor Chip Fabrication;Jeong;Annals of the CIRP,1996
2. Observations on Polishing and Ultraprecision Machining of Semiconductor Substrate Materials;Venkatesh;Annals of the CIRP,1995
3. CMP Pad Break-in Time Reduction in Silicon Wafer Polishing;Jeong;Annals of the CIRP,2007
4. Surface Evolution during the Chemical Mechanical Planarization;Che;Annals of the CIRP,2006
5. Technological Advances in Fine Abrasive Processes;Komanduri;Annals of the CIRP,1997
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