Surface Evolution during the Chemical Mechanical Planarization of Copper

Author:

Che W.,Bastawros A.,Chandra A.,Lonardo P.M.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference18 articles.

1. Chemical-Mechanical Polishing: Route to Global Planarization;Martinez;Solid State Technology,1994

2. Chemical-mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects;Kaufman;Journal of the Electrochemical Society,1991

3. Atlas of Electrochemical Equilibria in Aqueous Solutions;Pourbaix,1966

4. Initial Study on Copper CMP Slurry Chemistries;Carpio;Thin Solid Films,1995

5. Chemical-mechanical polishing of copper in alkaline media;Luo;Thin Solid Films,1997

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