Experimental Feasibility Study of Tunable-Stiffness Polishing Wheel via Integration of Magneto-Rheological Elastomers
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-30028-9_13
Reference24 articles.
1. M. R. Oliver (ed.), Chemical-Mechanical Planarization Of Semiconductor Materials, vol 69 (Springer, Berlin, 2013)
2. Y. Ein-Eli, D. Starosvetsky, Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—an electrochemical perspective. Electrochim. Acta 52(5), 1825–1838 (2007)
3. G. Nanz, L.E. Camilletti, Modeling of chemical-mechanical polishing: a review. IEEE Trans. Semicond. Manuf. 8(4), 382–389 (1995)
4. E.J. Terrell, C.F. Higgs, Hydrodynamics of slurry flow in chemical mechanical polishing a review. J. Electrochem. Soc. 153(6), K15–K22 (2006)
5. A.F. Bastawros, A. Chandra, Y. Guo, B. Yan, Pad effects on material-removal rate in chemical-mechanical planarization. J. Electron. Mater. 31(10), 1022–1031 (2002)
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