Author:
Lee Hyunseop,Wang Han,Park Jaehong,Jeong Haedo
Reference22 articles.
1. Metallization: theory and practice for VLSI and ULSI;Murarka,1993
2. Chemical mechanical planarization method for thick copper films of micro-electro-mechanical systems and integrated circuits;Lee;Jpn J Appl Phys,2008
3. Modeling of chemical–mechanical polishing: a review;Nanz;IEEE Trans Semicond Manuf,1995
4. Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces;Lee;CIRP Ann Manuf Technol,2009
5. Slurry particle behavior inside pad pore during chemical mechanical polishing;Kwark;J Korean Soc Tribol Lubr Eng,2012
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