Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Author:

Chen Wei-Yu,Yu Chi-Yang,Duh Jenq-Gong

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference25 articles.

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5. Sakuma K, Andry PS, Dang B, Maria J, Tsang C, Patel C, Wright SL, Webb B, Sprogis E, Kang SK, Polastre R, Horton R, Knickerbocker JU (2007) In: Proceeding of 57th electronic components of technology conference, IEEE Components, Packaging, and Manufacturing Technology, Reno, pp 627–632

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