Author:
Chen Wei-Yu,Yu Chi-Yang,Duh Jenq-Gong
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference25 articles.
1. Abtew M, Selvaduray G (2000) Mater Sci Eng R 27:95–141. doi: 10.1016/S0927-796X(00)00010-3
2. Frear DR, Jang JW, Lin JK, Zhang C (2001) JOM 53:28–33. doi: 10.1007/s11837-001-0099-3
3. Laurila T, Vuorinen V, Kivilahti JK (2005) Mater Sci Eng R 49:1–60. doi: 10.1016/j.mser.2005.03.001
4. Tanida K, Umemoto M, Tanaka N, Tomita Y, Takahashi K (2004) Jpn J Appl Phys 43:2264–2270. doi: 10.1143/JJAP.43.2264
5. Sakuma K, Andry PS, Dang B, Maria J, Tsang C, Patel C, Wright SL, Webb B, Sprogis E, Kang SK, Polastre R, Horton R, Knickerbocker JU (2007) In: Proceeding of 57th electronic components of technology conference, IEEE Components, Packaging, and Manufacturing Technology, Reno, pp 627–632
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献