Measurement of effective chemical shrinkage and equilibrium modulus of silicone elastomer used in potted electronic system

Author:

Sun Yong,Han Bongtae,Parsa Ehsan,Dasgupta Abhijit

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference22 articles.

1. Wang J-S, Tsai C-C, Liou J-S, Cheng W-C, Huang S-Y, Chang G-H, Cheng W-H (2012) Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests. Microelectron Reliab 52:813–817

2. Zhang Y, Wang Y-W, Zhang L-P, Lin X-J (2011) Current situation of silicone materials for high-power LED encapsulation [J]. Silicone Mater 3:010–015

3. Weng C-J (2009) Advanced thermal enhancement and management of LED packages. Int Commun Heat Mass Transfer 36:245–248

4. Croll SG (1979) Residual stress in a solventless amine-cured epoxy coating. J Coatings Technol 51:49–55

5. Shh S, Krguller M, Sarigaphuti M (1992) Effects of shrinkage-reducing admixtures on restrained shrinkage cracking of concrete. ACI Mater J 89:289–295

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