Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests-Reference-Cited by-同舟云学术

Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests

Published:2012-05 Issue:5 Volume:52 Page:813-817
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wang Jau-Sheng,Tsai Chun-Chin,Liou Jyun-Sian,Cheng Wei-Chih,Huang Shun-Yuan,Chang Gi-Hung,Cheng Wood-Hi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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