Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/article/10.1007/s10853-006-0892-z/fulltext.html
Reference17 articles.
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4. Bae KS, Kim SJ (2002) J Mater Res 17:743
5. Suganuma K (2001) Curr Opin Solid State Mater Sci 5:55
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