A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability-Reference-Cited by-同舟云学术

A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Gim Geondu¹,Park Jongmin¹,Lim Hunjung¹,Jung Gookjin¹

Affiliation:

1. Amkor Technology Korea, Inc.,Buk-gu,Gwangju,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013300.pdf?arnumber=10013300

Reference31 articles.

1. Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

2. Characterization of ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joint

3. Study on short time interfacial reactions between Sn-3.0 Ag-0.5 Cu solder balls and ENEPIG pads;fan;2012 13th International Conference on Electronic Packaging Technology & High Density Packaging,2012

4. Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

5. An investigation of reliability and solder joint microstructure evolution of select Pb-free FCBGA pad finish and solder ball alloy combinations;daniel;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC),2010

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