Author:
Lu Shibin,Wang Haibo,Meng Ying,Wang Feifei,Fan Min,Chen Junning
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering
Reference24 articles.
1. Wang H-B, Lu S-B, Yang J, Jiang X-W, Song Z-T, Liu W-L (2017) Chemical mechanical polishing of Ge2Sb2Te5 in alkaline slurry. J Vac Sci Technol B 35(4):041204
2. Wang H, Zhang Z, Lu S (2018) Study of several silica properties influence on sapphire CMP. J Electr Eng Technol 13(2):886–891
3. Bulick AS, Nishizawa H, Moriyama K, Yoshida K, Ezawa S, Arumugam S (2017) Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same. Google Patents
4. Zhou Y, Pan G, Gong H, Shi X (2017) Characterization of sapphire chemical mechanical polishing performances using silica with different sizes and their removal mechanisms. Colloids Surf A Physicochem Eng Aspects 153:153–159
5. Ein-Eli Y, Starosvetsky D (2007) Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—an electrochemical perspective. Electrochim Acta 52(5):1825–1838
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