Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates-Reference-Cited by-同舟云学术

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Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates

Published:2018-05-29 Issue:10 Volume:27 Page:5011-5017
ISSN:1059-9495
Container-title:Journal of Materials Engineering and Performance
language:en
Short-container-title:J. of Materi Eng and Perform

Author:

Soares D.,Leitão H.,Lau C. S.,Teixeira J. C.,Ribas L.,Alves R.,Teixeira S.,Cerqueira M. F.,Macedo F.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/article/10.1007/s11665-018-3419-2/fulltext.html

Reference47 articles.

1. M.F. Arenas and V.L. Acoff, Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrates, J. Electron. Mater., 2004, 33(12), p 1452–1458

2. S. Amore, E. Ricci, G. Borzone, and R. Novakovic, Wetting Behaviour of Lead-Free Sn-Based Alloys on Cu and Ni Substrates, Mater. Sci. Eng., A, 2008, 495(1–2), p 108–112

3. V. Vuorinen, T. Laurila, H. Yu, and J.K. Kivilahti, Phase Formation Between Lead-Free Sn-Ag-Cu Solder and Ni(P)/Au Finishes, J. Appl. Phys., 2006, 99(2), p 023530

4. C. Leinenbach, F. Valenza, D. Giuranno, H.R. Elsener, S. Jin, and R. Novakovic, Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates, J. Electron. Mater., 2011, 40(7), p 1533–1541

5. T. Chellaih, G. Kumar, and K.N. Prabhu, Effect of Thermal Contact Heat Transfer on Solidification of Pb-Sn and Pb-Free Solders, Mater. Des., 2007, 28(3), p 1006–1011

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1. Investigation to improve the printing accuracy of low-temperature paste based on rheological and optical measurement;Journal of Materials Science: Materials in Electronics;2024-01

2. Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates;Heliyon;2023-02

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4. Contact Angle Measurement of Melting SnAgCu Solder Paste Mix with Carbon Allotropes Using In-Line Digital Holography Technique;Key Engineering Materials;2021-11-22

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