Author:
Lin D.C.,Srivatsan T.S.,Wang G-X.,Kovacevic R.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference21 articles.
1. J.H. Lau, Solder Joint Reliability: Theory and Applications. Van Nostrand Reinhold, New York, p 1–30
2. P.A. Bouleau (1994) Packaging for Optoelectronic Interconnections. J. Metals 46(6):41–45
3. H. Mavoori (2000) Dimensionally Stable Solders for Optoelectronics and Microelectronics. J. Metals 52:29–32
4. J.L. Marshall, J. Calderon (1997) Hard-particle Reinforced Composite Solders Part 1: Micro-characterisation. Solder. Surface Mount Technol. 26:22–28
5. Y. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs, R.F. Pinizzotto (1993) The Formation and Growth of Intermetallic In Composite Solder. J. Electron. Mater. 22(7):769–777
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献