Hard‐particle Reinforced Composite Solders Part 1: Microcharacterisation-Reference-Cited by-同舟云学术

Hard‐particle Reinforced Composite Solders Part 1: Microcharacterisation

Published:1997-12 Issue:2 Volume:9 Page:22-28
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Marshall J.L.,Calderon J.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. Composite solders

2. Composite solders

3. 4Marshall, J.L., Calderon, J.G. and Sees, J.Proceedings Nepcon West Conference, Anaheim, CA, p. 1279 (1992).

4. 5Wassynczuk, J.A. and Lucey, G.K.Proceedings Nepcon West Conference, Anaheim, CA, p, 1245 (1992).

5. 7Clough, R.B., Patel, R., Hwang, J.S. and Lucey, G.K.Proceedings Nepcon West Conference, Anaheim, CA, p. 1256 (1992).

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