Enhancing creep resistance of SnBi solder alloy with non-reactive nano fillers: A study using nanoindentation
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference43 articles.
1. Composite lead-free electronic solders;Guo;J. Mater. Sci. Mater. Electron.,2007
2. Impression creep of a lead-free Sn-1.7Sb-1.5Ag solder reinforced by submicron-size Al2O3 particles;Kangooie;J. Electron. Mater.,2009
3. Composite solders;Marshall;IEEE Trans.Comp. Hybrids. Manufact. Technol.,1991
4. Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints;Guo;J. Mater. Sci.,2009
5. Research advances in nano-composite solders;Shen;Microelectron. Reliab.,2009
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of Different Zinc Content on Solidification, Microstructure, and Mechanical Properties in Tin–Bismuth Alloy;Advanced Engineering Materials;2024-07-30
2. Nanoindentation creep mechanism of gradient ultrafine lamellar γ+Ni5Zr eutectic using electromagnetic levitation coupled with fall casting;Intermetallics;2024-07
3. Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism;Journal of Materials Research and Technology;2024-07
4. Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging;Journal of Adhesion Science and Technology;2024-05-23
5. Effects of Thermal Cycling and PCB Substrate Type on Reliability of Solder Joints;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3