Ultrasonic-assisted soldering of Mg alloy joints using Cu-foam/Sn composite solder foils

Author:

Li Shiqin,Zhang Yinggan,Cao Huijun,Zheng Xuzhang,Zhang Shuye,Zhang Zhihao

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Engineering (miscellaneous),Chemical Engineering (miscellaneous)

Reference30 articles.

1. Ready for the road[J];Frankel;Nat. Mater.,2015

2. Towards developing Mg alloys with simultaneously improved strength and corrosion resistance via RE alloying[J];Xie;J. Magnes. Alloy.,2021

3. Corrosion behaviours and mechanical properties of Fe/Mg–8Al–1 Zn matrix composite[J];Chen;Mater. Sci. Technol.,2017

4. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: phenomena, mechanism and prevention[J];Li;Sci. Rep.,2016

5. Aqueous electrochemistry of the magnesium surface: thermodynamic and kinetic profiles[J];Yuwono;Corros. Sci.,2019

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