A novel bright additive for copper electroplating: electrochemical and theoretical study-Reference-Cited by-同舟云学术

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A novel bright additive for copper electroplating: electrochemical and theoretical study

Published:2022-11-04 Issue:1 Volume:29 Page:363-375
ISSN:0947-7047
Container-title:Ionics
language:en
Short-container-title:Ionics

Author:

Li Yaqiang,Ren Penghui,Li Ruopeng,Zhang Yuanhang,Zhang Jinqiu,Yang Peixia,An Maozhong

Publisher

Springer Science and Business Media LLC

Subject

General Physics and Astronomy,General Engineering,General Materials Science,General Chemical Engineering

Link

https://link.springer.com/content/pdf/10.1007/s11581-022-04799-7.pdf

Reference55 articles.

1. Andricacos PC, Uzoh C, Dukovic JO et al (1998) Damascene copper electroplating for chip interconnections. IBM J Res Dev 42(5):567–574. https://doi.org/10.1147/rd.425.0567

2. Li Z, Wei H, Kai Z et al (2018) Investigation of poly (1-vinyl imidazole Co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole. Electrochim Acta 283:560–567. https://doi.org/10.1016/j.electacta.2018.06.132

3. Chen C, Li Y, Yu S et al (2020) Cu-Ag tandem catalysts for high-rate CO2 electrolysis toward multicarbons. Joule 4(8):1688–1699. https://doi.org/10.1016/j.joule.2020.07.009

4. Xu H, Rebollar D, He H et al (2020) Highly selective electrocatalytic CO2 reduction to ethanol by metallic clusters dynamically formed from atomically dispersed copper. Nat Energy 5(8):623–632. https://doi.org/10.1038/s41560-020-0666-x

5. Chong L, Hua L et al (2018) Designing robust underwater superoleophobic microstructures on copper substrates. Nanoscale 10(43):20435–20442. https://doi.org/10.1039/c8nr05173a

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