Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics-Reference-Cited by-同舟云学术

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Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics

Published:2016-04 Issue:4 Volume:17 Page:445-452
ISSN:2234-7593
Container-title:International Journal of Precision Engineering and Manufacturing
language:en
Short-container-title:Int. J. Precis. Eng. Manuf.

Author:

Kang Min-Soo,Jeon Yu-Jae,Kim Do-Seok,Shin Young-Eui

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s12541-016-0055-3.pdf

Reference25 articles.

1. Chan, S. I., Kang, J. H., and Jang, J. S., “Reliability Improvement of Automotive Electronics based on Environmental Stress Screen Methodology, Microelectronics Reliability, Vol. 53, No. 9, pp. 1235–1238, 2013.

2. Lall, P., Islam, M. N., Singh, N., Suhling, J. C., and Darveaux, R., “Model for BGA and CSP Reliability in Automotive Underhood Applications, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, pp. 585–593, 2004.

3. Jeon, Y.-J., Kim, D.-S., and Shin, Y.-E., “Study of Characteristics of Solar Cells through Thermal Shock and High-Temperature and High-Humidity Testing, Int. J. Precis. Eng. Manuf., Vol. 15, No. 2, pp. 355–360, 2014.

4. Yang, Z. J., Yang, S. M., Yu, H. S., Kang, S. J., Song, J. H., and Kim, K. J., “IMC and Creep Behavior in Lead-Free Solder Joints of Sn-Ag and Sn-Ag-Cu Alloy System by SP Method, International Journal of Automotive Technology, Vol. 15, No. 7, pp. 1137–1142, 2014.

5. Yang, Z.-J., Yu, H.-S., Yang, S.-M., Song, J.-H., and Park, S.-Y., “Prediction of Steady-State Creep Strain Rate and Rupture Life for Snag-based Lead-Free Solder Joints by SP Test, Int. J. Precis. Eng. Manuf., Vol. 14, No. 7, pp. 1245–1250, 2013.

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