Wafer bin map inspection based on DenseNet
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,General Engineering
Link
https://link.springer.com/content/pdf/10.1007/s11771-021-4778-7.pdf
Reference45 articles.
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4. WANG C H, KUO W, BENSMAIL H. Detection and classification of defect patterns on semiconductor wafers [J]. IIE Transactions, 2006, 38(12): 1059–1068. DOI: https://doi.org/10.1080/07408170600733236.
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