Author:
Mariani Stefano,Martini Roberto,Ghisi Aldo,Corigliano Alberto,Simoni Barbara
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,Modeling and Simulation,Computational Mechanics
Cited by
33 articles.
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1. Optimization of the Geometry of a Microelectromechanical System Testing Device for SiO2—Polysilicon Interface Characterization;ECSA 2023;2023-11-15
2. Characterization of Polysilicon Strength through On-Chip Testing at MEMS Stoppers;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanics-driven Investigation;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength;Micromachines;2023-02-13
5. On-Chip Tests for the Characterization of the Mechanical Strength of Polysilicon;The 9th International Electronic Conference on Sensors and Applications;2022-11-01