Characterization of strength properties of thin polycrystalline silicon films for MEMS applications-Reference-Cited by-同舟云学术

Characterization of strength properties of thin polycrystalline silicon films for MEMS applications

Published:2007-01 Issue:1 Volume:30 Page:2-12
ISSN:8756-758X
Container-title:Fatigue & Fracture of Engineering Materials and Structures
language:en
Short-container-title:Fat Frac Eng Mat Struct

Author:

Boroch R.,Wiaranowski J.,Mueller-Fiedler R.,Ebert M.,Bagdahn J.

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1460-2695.2006.01055.x/fullpdf

Reference12 articles.

1. 2 M. Offenberg, H. Munzel, and D. Schubert . Acceleration Sensor in Surface Micromachining for Airbag Applications with High Signal/Noise Ratio . SAE Technical Paper Series, 960758.

2. Microstructure of thick polycrystalline silicon films for MEMS application

3. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On-Chip Tests for the Characterization of the Mechanical Strength of Polysilicon;The 9th International Electronic Conference on Sensors and Applications;2022-11-01

2. Accidental Drop Impact;Mechanics of Microsystems;2018-02-12

3. Determination of polysilicon Weibull parameters from indentation fracture;Thin Solid Films;2017-11

4. Mechanical Properties of Micromachined Structures;Springer Handbook of Nanotechnology;2017

5. Microscopic strength of silicon particles in an aluminium–silicon alloy;Acta Materialia;2016-02