Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength-Reference-Cited by-同舟云学术

Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength

Published:2000-05 Issue:1-3 Volume:83 Page:172-178
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Yi Taechung,Li Lu,Kim Chang-Jin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Mechanical Metallurgy;Dieter,1986

2. Measurement of elastic constants at low temperatures by means of ultrasonic waves — data for silicon and germanium single crystals, and for fused silica;McSkimin;J. Appl. Phys.,1953

3. Third-order elastic constants and the velocity of small amplitude elastic waves in homogeneously stressed media;Thurston;Phys. Rev.,1964

4. Electronic effects in the elastic constants of n-type silicon;Hall;Phys. Rev.,1967

5. ASTM Standard C 623-92, Standard Test Method for Young's Modulus, Shear Modulus, and Poisson's Ratio for Glass and Glass–Ceramic by Resonance, Annual Book of ASTM Standards.

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