Vapor Pressure and Residual Stress Effects on Mixed Mode Toughness of an Adhesive Film

Author:

Chew H. B.,Guo T. F.,Cheng L.

Publisher

Springer Science and Business Media LLC

Subject

Mechanics of Materials,Modeling and Simulation,Computational Mechanics

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Microstructure effects on fatigue crack growth in additively manufactured Ti–6Al–4V;Materials Science and Engineering: A;2020-09

4. Role of Vapor Pressure on Popcorn Cracking in IC Packages;Materials Performance and Characterization;2014-02-28

5. Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices;Moisture Sensitivity of Plastic Packages of IC Devices;2010

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